Modified PTFE GBK Sheet

Raw Materials: PTFE resin hpe galai shai ai, GBK composite fiber hpe madi shadaw ai hku nna.
Process: RANA gaw PTFE matrix hta glass fiber hpun palawng hpe langai sha re ai hku garan gachyan ai hpe "hot-p hka lim ai lam" hku nna galaw ya ai.
Madung: GBK fiber a galai shai ai PTF hte "n-gun kaba + n-gun + n-gun + n-gun kaba + n-gun + n-gun kaba ai hpe ninghkap lu ai" ngu ai arawn alai ni hpe kayau kaya galaw ai gaw, n-gun n-gun hpe shayawm ya lu ai (particle adsorption hpe koi kau ai) hte galu kaba ai n-gun hpe ninghkap lu ai atsam (100,000 100,000 lang ngut ai hpang n-gun n rawng ai) hpe madi shadaw ya ai.

Kaja ai lam ni: Taiwan hpaji ninghkring hpung langai hku nna jep joi hkrum ai, npu na n-gun n-gun gaw, semiconductor Class 10 san seng ai workshop (20 particles hta grau nna (sh) maren sha re ai, 200℃kaw nna 280℃du hkra hte 20 jan na utility model patents ni hte, semiconductor Class 10 san seng ai bungli hta lang ai shaloi, 5 particles/m2 hte maren sha rai nga ai.
Application Scenarios: Semiconductor wafer galaw shapraw ai (ga shadawn, photoresist storking tanks) hte electronic arung arai ni hpe jasan jaseng ai (ga shadawn, PCB jasan jaseng ai tank ni) hta lang ai. SMIC hte BOE a matu hparan ladat ni hpe jaw ya ai, dai gaw, wan n-gun n-gun shayawm ai majaw byin pru wa ai arung arai ni hpe shayawm ya lu ai (ga shadawn, chip n-gun n-gun n-gun 2% shayawm ya lu ai.

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